ITherm 2012

ITherm 2012 (http://www.ithermconference.org) is the leading international conference for scientific and engineering exploration of thermal, thermomechanical and emerging technology issues associated with electronic devices, packages, and systems.  ITherm 2012 will be held along with the 62nd Electronic Components and Technology Conference (ECTC 2012, http://www.ectc.net), a premier electronic packaging conference, in San Diego, California.   Based on the success of ITherm 2010, papers will be presented in stand-up and selected topical poster sessions.  Poster sessions, which allow a high level of author/audience interaction, will play a major role in this and future ITherm conferences.  All papers will be peer reviewed by two or more reviewers, and will be published in the ITherm proceedings.  In addition to paper presentations and vendor exhibits, ITherm 2012 will include panel discussions, keynote lectures by prominent speakers, and professional short courses. Original papers are solicited in the general areas of (but not limited to):

Thermal Management:
•Novel Materials: Thermal Vias, Heat Spreaders and Thermal Interface Materials
•Natural and Forced Convection Air Cooling
•Advances in Compact Air Movers
•Single Phase Liquid Cooling
•Novel Phase Change Cooling Techniques: Boiling, Heat Pipes, Thermosyphon, Spray and Jet Impingement
•Microfabricated Thermal Management Devices and Systems
•Sub-Ambient Cooling: Solid State, Vapor Compression, Absorption, Adsorption, Thermo-acoustic, Magnetocaloric
•Thermal Management in Wireless, Networking, Computing, Lighting, Harsh Environments, and Peripheral Hardware.
•Thermal and Energy Management in Data Centers
•Three-Dimensional Electronics
•Advances in Experimental Characterization
•Advances in Computational Characterization: Multi-Scale Modeling, Compact Modeling, Multi-Physics Modeling, Multi-Objective Design
    and Optimization

Mechanics:
•Modeling and Simulation for Reliability at Package, Board, and System Levels
•Failure Mechanics and Damage Modeling
•Experimental Techniques
•Constitutive Models
•Impact, Drop and Vibrational Analysis of Packages, Sub-Systems, and Systems
•Solder Profile Modeling, Fatigue Mechanics of Packages, Interconnects
•Materials
   - Design, Synthesis, and Processing of Materials for Thermal/Thermo-Mechanical Management in Electronic Systems
   - Thermo-mechanical Characterization and Modeling of Packaging Materials
   - Material Interfaces: Engineering, Characterization and Simulation

Emerging Technologies: 
•Sensors (Medical, Military, Consumer, Structures, Diagnostic, etc.)
•Nanotechnology: Thermal, Mechanics, Material and Process Related Issues in Nanostructures
•Micro-Fluidics
•Fiber-Optics Interconnect Systems & Free Space Optical Interconnects
•MEMS: Device and Package Level Reliability Issues
•Integrated Biochips and Bioelectronics
•Medical, Telecommunication, and Automotive Systems
•Space Systems: Earth Orbiting and Deep-Space Missions

Panel Discussions:
•Proposals are solicited for panel discussion topics addressing contemporary issues of broad interest to the ITherm
  community.  These should include a title, an abstract describing the theme(s) to be addressed, and a list of
  potential panelists.

Abstract and subsequent paper submissions are entirely web-based, with the following deadlines.  Please submit a 400 word text-only (no figures and    tables) abstract to ITherm website: http://www.ithermconference.org.  The Abstracts will be considered for oral or poster sessions.  The authors will be informed regarding the session format (poster or stand up) at the time of abstract acceptance. 

Some important dates:
•Deadline for Submission of Abstracts  October 7, 2011 (extended till Oct 15, 2011)
•Notification of Abstract Acceptance  October 15, 2011
•Draft Paper Submission   December 14, 2011 (extended till Jan 7, 2012)
•Final Paper Web Submission   March 3, 2012

Direct general inquiries to:
General Chair                    
Dr. Sandeep Tonapi
Anveshak Inc.
732 W. Hemlock Way
Chandler AZ 85248 
480-518-7393
sandeep.tonapi@anveshak.com