ITherm 2010

ITherm 2010 (http://www.ithermconference.org) is the leading international conference for scientific and engineering exploration of thermal, thermomechanical and emerging technology issues associated with electronic devices, packages, and systems.  ITherm 2010 will be held along with the 60th Electronic Components and Technology Conference (ECTC 2010, http://www.ectc.net), a premier electronic packaging conference, in Las Vegas, Nevada.  Based on the success of ITherm 2008, papers will be presented in stand-up and selected topical poster sessions.  Poster sessions, which allow a high level of author/audience interaction, will play a major role in this and future ITherm conferences.  All papers will be peer reviewed by two or more reviewers, and will be published in the ITherm proceedings.  In addition to paper presentations and vendor exhibits, ITherm 2010 will include panel discussions, keynote lectures by prominent speakers, and professional short courses. Original papers are solicited in the general areas of (but not limited to):

Thermal Management:
• Novel Materials: Thermal Vias, Heat Spreaders and Thermal Interface Materials
• Natural and Forced Convection Air Cooling
• Advances in Compact Air Movers
• Single Phase Liquid Cooling
• Novel Phase Change Cooling Techniques: Boiling, Heat Pipes, Thermosyphon, Spray and Jet Impingement
• Microfabricated Thermal Management Devices and Systems
• Sub-Ambient Cooling: Solid State, Vapor Compression, Absorption, Adsorption, Thermo-acoustic, Magnetocaloric
• Thermal Management in Wireless, Networking, Computing, Lighting, Harsh Environments, and Peripheral Hardware.
• Thermal and Energy Management in Data Centers
• Three-Dimensional Electronics
• Advances in Experimental Characterization
• Advances in Computational Characterization: Multi-Scale Modeling, Compact Modeling, Multi-Physics Modeling, Multi-Objective Design
    and Optimization

Mechanics:
• Modeling and Simulation for Reliability at Package, Board, and System Levels
• Failure Mechanics and Damage Modeling
• Experimental Techniques
• Constitutive Models
• Impact, Drop and Vibrational Analysis of Packages, Sub-Systems, and Systems
• Solder Profile Modeling, Fatigue Mechanics of Packages, Interconnects
• Materials
   - Design, Synthesis, and Processing of Materials for Thermal/Thermo-Mechanical Management in Electronic Systems
   - Thermo-mechanical Characterization and Modeling of Packaging Materials
   - Material Interfaces: Engineering, Characterization and Simulation

Emerging Technologies: 
• Sensors (Medical, Military, Consumer, Structures, Diagnostic, etc.)
• Nanotechnology: Thermal, Mechanics, Material and Process Related Issues in Nanostructures
• Micro-Fluidics
• Fiber-Optics Interconnect Systems & Free Space Optical Interconnects
• MEMS: Device and Package Level Reliability Issues
• Integrated Biochips and Bioelectronics
• Medical, Telecommunication, and Automotive Systems
• Space Systems: Earth Orbiting and Deep-Space Missions

Panel Discussions:
• Proposals are solicited for panel discussion topics addressing contemporary issues of broad interest to the ITherm community.  
  These should include a title, an abstract describing the theme(s) to be addressed, and a list of potential panelists.

  Abstract and subsequent paper submissions are entirely web-based, with the following deadlines.  Please submit a 400 word
  text-only (no figures and tables) abstract to ITherm website: http://www.ithermconference.org.  The Abstracts will be
  considered for oral or poster sessions.  The authors will be informed regarding the session format (poster or stand up) at the
  time of abstract acceptance. 

Some important dates:
• Deadline for Submission of Abstracts  August 31, 2009 September 30, 2009
• Notification of Abstract Acceptance  September 28, 2009  October 15, 2009
• Draft Paper Submission   December 14, 2009
• Final Paper Web Submission   March 7, 2010

Direct general inquiries to:
General Chair                                                        Program Chair
Prof. Yogendra Joshi                                             Dr. Sandeep Tonapi
General Chair, ITherm 2010                                   General Chair, ITherm 2010
G.W. Woodruff School of Mechanical Engineering      Anveshak Inc.
Georgia Institute of Technology
Atlanta, GA 30332
Phone: 404-385-2810
Email: yogendra.joshi@me.gatech.edu