| General Chair: |
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Dr. Sandeep Tonapi
Anveshak TEchnology and Knowledge Solutions
Chandler, AZ
480-518-7393
sandeep.tonapi@anveshak.com
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| Program Chair: |
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Prof. Mehdi Asheghi
Stanford University
Mechanical Engineering Department
Stanford, CA
Phone : 724-612-3216
masheghi@stanford.edu
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| Thermal Management Track: |
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Dr. Madhusudan Iyengar, Chair
IBM
Poughkeepsie, NY
Phone : 845-433-3708
mki@us.ibm.com
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Prof. Kaz Yazawa , Co-Chair
Electrical Engineering, University of California Santa Cruz
1156 High Street, M/S SoE2,
Santa Cruz, CA 95064
Phone: (831) 459-1021
kaz@soe.ucsc.edu
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Dr. Thomas Brunschwiler, Co-Chair
IBM Zurich Research Laboratory
Science & Technology
Advanced Thermal Packaging
Säumerstrasse 4 CH-8803 R?schlikon / Switzerland
Phone : +41 - 44 - 724 86 81
tbr@zurich.ibm.com
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| Mechanics Track: |
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Prof. Abhijit Dasgupta, Chair
Professor, Mechanical Engineering Dept.
2110 Martin Hall
University of Maryland, College Park, MD 20742
Phone: 301 405-5251
dasgupta@umd.edu
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Prof. Bernhard Wunderle, Co-Chair
Chair Materials and Reliability of Microsystems
Faculty for Electrical Engineering and Information Technology
Chemnitz University of Technology
Reichenhainer Str. 70
D-09126 Chemnitz, Germany
Tel: +49 (0)371 531 38124
bernhard.wunderle@etit.tu-chemnitz.de
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Dr. Satish Chaparala, Co-Chair
Senior Research Scientist
Inorganic & Broad-Based Technologies
SP-PR-02-1
Corning Incorporated
Corning, NY, 14831
Phone : 607-222-8534 (M)
chaparalsc@corning.com
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| Emerging Technologies Track: |
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Prof. Samuel Graham, Chair
Woodruff School of Mechanical Engineering
Georgia Institute of Technology
771 Ferst Dr
Atlanta, GA 30332-0405
Phone : 404-894-2264 (office)
sgraham@gatech.edu |
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Dr. Kaustubh Nagarkar, Co-Chair
Electronic Packaging Engineer
Micro and Nano Structures Technologies, GE Global Research
1 Research Circle, KWC 1804
Niskayuna, NY 12309, USA
Phone : +1 518 387 5865
nagarkar@research.ge.com
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Prof. Fatemeh Hassanipour, Co-Chair
Mechanical Engineering Department
The University of Texas at Dallas
Phone : 972-883-2914
fatemeh@utdallas.edu
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| Panel Discussions: |
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Prof. YC Lee, Chair
Deparment of Mechanical Engineering
Director of DARPA Center on Nanoscale Science and Technology for Integrated Micro/Nano-Electromechanical Transducers (iMINT)
Administrative Director of Nanomaterials Characterization Facility
University of Colorado, Boulder, CO 80309-0427
Phone: (303)492-3393
leeyc@colorado.edu
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Dr. Victor Chiriac, Co-Chair,
Qualcomm Inc.
San Diego, CA 9212
Phone : 858-651-7460
vchiriac@qualcomm.com
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Dr.Arun Gowda, Co-Chair
GE Global Research
Niskayuna, NY
Phone : 518-387-6316
gowda@research.ge.com
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Prof. Michael Ohadi
4164C Glenn L. Martin Hall
University of Maryland
College Park, MD 20742
Phone : 301.405.5263
ohadi@umd.edu
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| Keynote Speakers: |
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Prof. Yogendra K. Joshi, Chair
Georgia Institute of Technology
Atlanta, GA
Phone : 404-385-2810
yogendra.joshi@me.gatech.edu
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Gamal Refai-Ahmed, PhD, PEng, Life Fellow ASME
Fellow Canadian Academy of Engineering
Chief Scientist
PreQual Tech Corp
Visiting Professor, Watson School, SUNY
Visiting Distinguished Fellow, CUE, Ryerson University
Chair of Electronics Packaging and Photonics Division, ASME
Associate Editor, J Electronics Packaging, ASME
Associate Editor, J CPMT, IEEE
Phone : 6473009498
gamal.refai@gmail.com
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| ITherm Achievement Award: |
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Prof. Sushil Bhavnani , Chair
Department of Mechanical Engineering
268 Ross Hall
Auburn University, AL 36849-5341
Phone: (334) 844-3303
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Koneru Ramakrishna , Co-Chair
Anveshak Technology and Knowledge Solutions
Austin, Texas
Phone: (512)-680-4169
rama@anveshak.com, rama@ieee.org
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Ricky Lee, Co-Chair
Department of Mechanical Engineering
Hong Kong University of Science and Technology
Clear Water Bay
Kowloon, Hong Kong
Tel: +852-23587203, Fax: +852-23591543
rickylee@ust.hk
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| Exhibits: |
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Dr. Victor Chiriac, Chair
Qualcomm Inc.
San Diego, CA 9212
Phone : 858-651-7460
E-mail:
vchiriac@qualcomm.com |
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Dr. Milena Vujosevic, Co-Chair
Senior Member of Technical Staff
Technology Manufacturing Group
Intel Corporation
Rescue, CA
Phone : 916-377-8548
E-mail:
milena.vujosevic@intel.com
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