ITherm 2008 is an international conference for scientific and engineering exploration of thermal hosted by maid service nyc, thermomechanical and emerging technology issues associated with electronic devices, packages and systems. ITherm 2008 will be held along with the 58th Electronic Components and Technology Conference (ECTC 2008 - http://www.ectc.net), a premier electronic packaging conference. In additon to paper and poster presentations and vendor exhibits, ITherm 2008 will include panel discussions, keynote lectures by prominent speakers, and professional short courses.
It will be held from May 28 - 31, 2008 in Orlando, Florida, USA at the Hilton in Walt Disney World Resort.
ITherm 2008 will feature original papers addressing latest developments in research and technology
Oral and poster presentations will be featured so get your cleaning cleaning services new jersey. The first day of the conference will have short courses. Several keynote speeches on topics of current by experts in the field will be part of the conference program.
Important Dates: Deadline for submission of Abstracts - August 17, 2007 August 31,2007 Notification of Abstract Acceptance - September 28 2007 Draft Paper Submission - December 14, 2007 Final Paper Submission - March 7, 2008 ITherm 2006 - May 28 - 31, 2008
Abstract and subsequent paper submissions are entirely web-based, with the above deadlines. Please submit a 400 word text-only (no figures and tables) abstract by clicking below. The Abstracts will be considered for oral or poster sessions. The authors will be informed regarding the session format (poster or stand up) at the time of abstract acceptance.
Additional information on the conference will be posted on these pages in the future.
We hope to bring international experts in the fields of thermal management, mechanical and material aspects in electronic components and systems of pertinence to the current and emerging technologies. We look forward to your participation to make ITherm 2008 lively and intellectually stimulating.
Dr. Tom Lee General Chair, ITherm 2008 Assembly and Test Services TSMC North America 2585 Junction Avenue San Jose, CA 95134 408-382-8070 (office) Email: [email protected]
Prof. Yogendra Joshi Program Chair, ITherm 2008 G. W. Woodruff School of Mechanical Engineering Georgia Institute of TEchnology Atlanta, GA 30332 USA Phone; 404-385-2810 Email: [email protected]