ITherm 2012

May 30-June 1, 2012

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ITherm 2012
Sheraton San Diego Hotel and Marina
San Diego, California, USA
May 30 - June 1, 2012

ITherm 2012 is an international conference for scientific and engineering exploration of thermal, thermomechanical and emerging technology issues associated with electronic devices, packages and systems. ITherm 2012 will be held along with the 62nd Electronic Components and Technology Conference (ECTC 2012 - http://www.ectc.net), a premier electronic packaging conference. In additon to paper and poster presentations and vendor exhibits, ITherm 2012 will include panel discussions, keynote lectures by prominent speakers, and professional short courses.

It will be held from May 30 - June 1, 2012 in San Diego, California, USA at the Sheraton San Diego Hotel and Marina.

ITherm 2012 will feature original papers addressing latest developments in research and technology 

   Thermal Management
   Mechanics 
   Emerging Technologies: Thermal, Thermomechanical and/or related underlying 
          multidisciplinary issues 
   Panel Discussions
   Poster Sessions

Oral and poster presentations will be featured. The first day of the conference will have short courses. Several keynote speeches on topics of current by experts in the field will be part of the conference program.

Important Dates:
   Deadline for submission of Abstracts - October 7, 2011 (extended till Oct 15, 2011)
   Notification of Abstract Acceptance - October 15, 2011
   Draft Paper Submission - December 14, 2011 (extended till Jan 7, 2012) 
   Final Paper Submission - March 3, 2012 
   ITherm 2012 - May 30 - June 1, 2012

Abstract and subsequent paper submissions are entirely web-based, with the above deadlines.  Please submit a 400 word text-only (no figures and tables) abstract by clicking below.  The Abstracts will be considered for oral or poster sessions.  The authors will be informed regarding the session format (poster or stand up) at the time of abstract acceptance. 

To submit your ABSTRACT, Click Here!
To submit your DRAFT PAPER, Click Here!
To submit your FINAL PAPER, Click Here!

Additional information on the conference will be posted on these pages in the future.

We hope to bring international experts in the fields of thermal management, mechanical and material aspects in electronic components and systems of pertinence to the current and emerging technologies. We look forward to your participation to make ITherm 2012 lively and intellectually stimulating. 


Prof. Mehdi Asheghi
Program Chair, ITherm 2012
Stanford University
Mechanical Engineering Department
Stanford, CA. 94305-3030
724-612-3216
masheghi@stanford.edu