ITherm 2012

Dr. Bahgat Sammakia serves as a professor of mechanical engineering in the Thomas J. Watson School of Engineering and Applied Science at Binghamton University and as director of Binghamton University's Small Scale Systems Integration and Packaging Center, a New York State Center of Excellence. Dr. Sammakia is the Interim Vice President for Research at Binghamton University. Dr. Sammakia has spent much of his 30-year research career working to improve thermal management strategies in electronics packaging, distinguishing himself in the laboratory and at the helm of major research initiatives.

Dr. Sammakia joined the faculty of the Watson School in 1998 following a fourteen-year career at IBM where he worked in the area of research and development of organic electronic systems. He has contributed to several books on natural convection heat transfer and is also the principal investigator or co-principal investigator on millions of dollars of cross-disciplinary research projects. Dr. Sammakia earned his bachelor's degree in mechanical engineering from the University of Alexandria, Egypt, and his master's and doctorate in mechanical engineering from the State University of New York at Buffalo. He was a post doctoral fellow at the University of Pennsylvania.

Dr. Sammakia has over 180 published papers in refereed journals and conference proceedings, has contributed to five books in the areas of heat transfer and electronics packaging, and holds fourteen US patents in the area of electronics packaging. Dr. Sammakia is an ASME fellow and a member of the IEEE. He is the editor of the Journal of Electronic Packaging, Transactions of the ASME and an associate editor of the CPMT Transactions of the IEEE. Professor Sammakia was the Chair of the ASME K16 committee on thermal management of electronic systems from 2005 to 2007.

ITHERM ACHIEVEMENT AWARD GUIDELINES

GENERAL
The ITherm Achievement Award, first instituted in 1996, is presented biennially in recognition of significant contributions made in thermal and thermomechanical management of electronics.

The Award, to be presented at the ITherm Banquet includes a memento, a plaque, and an honorarium.  Travel, conference registration, and lodging will be complimentary.  The recipient is expected to attend ITherm and present an Invited Lecture on the topic of their choosing.

The recipient is selected by an Award Committee comprised of the ITherm Executive Committee (past ITherm General Chairs), the Conference General Chair, and the Conference Program Chair(s).  If any of the committee members listed above are Award nominees, they will be excused from the selection process.  The Committee will be chaired by a member of the ITherm Executive Committee, appointed by the Conference General Chair. 

SELECTION CRITERIA
Selection criteria (weightage in parentheses) include the following:
       
PIONEERING electronics thermal/thermomechanical research contributions 33%
SUSTAINED electronics thermal/thermomechanical research contributions 33%
SERVICE to the electronics thermal/thermo-mechanical management community and SUPPORT of ITherm-related activities 33%

These criteria will be publicized on the ITherm website and communicated via email to various mailing lists.

NOMINATION MATERIAL
The nomination package should include:
NOMINATION letter no longer than 2 pages, listing key accomplishments and basis for nomination
LETTERS of support (up to four letters may be submitted)

Nominations will be considered active for the year in which they were submitted and the two subsequent award cycles (four additional years).  Nominators will be contacted during every cycle to see if they would like to avail of the additional cycles of eligibility for their nominee.

These requirements will be publicized on the ITherm website and communicated via email to various mailing lists.

SUBMISSION DEADLINE
Nominations will be submitted to the Committee Chair by March 1st of the year of the conference.

SELECTION PROCEDURE
Completed nomination packages will be distributed to the Committee for consideration, not less than 1-2 weeks before the balloting.  The list of candidates will be voted on in a two-step process as follows:
Step 1: Every committee member shall select a top five (unranked selection) from among the pool of nominees.  This selection may either be done during a conference call or anonymously via email to the Conference Administrative Chair, who shall serve as a vote tabulator.  This first step will yield a list of the top vote-getting nominees.

Step 2:  The top four (or five, at the discretion of the committee) nominees will be voted on using a ranking system awarding 4 points to the top candidate, 3 to the next best, and so on.  Votes will be mailed in to the Administrative Chair, who will serve as vote tabulator.  This second step will be used to identify a consensus Award recipient.

The selected recipient will be notified informally by the nominator and formally by the Conference Chair. After this, the Award Committee Chair will work with the Conference Chair and the nominator to develop the details of the Award ceremony.

The nominator will obtain the recipient’s biographical sketch/photograph so that it can be published in the conference proceedings.

APPROVED AT SAN DIEGO ITHERM 2002 EXECUTIVE COMMITTEE MEETING 5/29/02

Please send the nomination letter (and support letters) to either of
the co-chairs listed below:

ITherm 2012 Achievement Award:

Prof. Sushil H. Bhavnani, Chair
bhavnani@eng.auburn.edu
268 Ross Hall
Department of Mechanical Engineering
Auburn University, Auburn, AL 36849-5341
(334)844-3303 (voice)
(334)844-3307 (fax)

Dr. Koneru Ramakrishna, Co-chair
rama@anveshak.com
(512)-680-4169
Anveshak Technology and Knowledge Solutions
Austin, TX

Ricky Lee, Co-chair
rickylee@ust.hk
+852-23587203
Department of Mechanical Engineering
Hong Kong University of Science and Technology
Clear Water Bay
Kowloon, Hong Kong