ITherm 2008 is an international conference for scientific and engineering exploration of thermal hosted, thermomechanical and emerging technology issues associated with electronic devices, packages and systems. ITherm 2008 will be held along with the 58th Electronic Components and Technology Conference (ECTC 2008 - http://www.ectc.net), a premier electronic packaging conference. In additon to paper and poster presentations and vendor exhibits, ITherm 2008 will include panel discussions, keynote lectures by prominent speakers and professional short courses.
It will be held from May 28 - 31, 2008 in Orlando, Florida, USA at the Hilton in Walt Disney World Resort.
ITherm 2008 will feature original papers addressing latest developments in research and technology
Thermal Management
Mechanics
Emerging Technologies: Thermal, Thermomechanical and/or related underlying
multidisciplinary issues
Panel Discussions
Poster Sessions
Oral and poster presentations will be featured.
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Discover the latest advancements in thermal management, mechanics, and emerging technologies within the realm of electronic devices, packages, and systems at ITherm 2008. This cutting-edge conference, held in conjunction with the 58th Electronic Components and Technology Conference (ECTC 2008), promises a dynamic blend of paper and poster presentations, vendor exhibits, panel discussions, keynote lectures by industry luminaries, and professional short courses. From May 28 to 31, 2008, join us in the enchanting city of Orlando, Florida, USA, at the Hilton in Walt Disney World Resort for a deep dive into the future of thermal technology.
The first day of the conference will have short courses. Several keynote speeches on topics of current by experts in the field will be part of the conference program.
Important Dates:
Deadline for submission of Abstracts - August 17, 2007 August 31,2007
Notification of Abstract Acceptance - September 28 2007
Draft Paper Submission - December 14, 2007
Final Paper Submission - March 7, 2008
ITherm 2006 - May 28 - 31, 2008
Abstract and subsequent paper submissions are entirely web-based, with the above deadlines. Please submit a 400 word text-only (no figures and tables) abstract by clicking below. The Abstracts will be considered for oral or poster sessions. The authors will be informed regarding the session format (poster or stand up) at the time of abstract acceptance.
To submit your ABSTRACT, Click Here!
To submit your DRAFT PAPER, Click Here!
To submit your FINAL PAPER, Click Here!
Additional information on the conference will be posted on these pages in the future.
We hope to bring international experts in the fields of thermal management, mechanical and material aspects in electronic components and systems of pertinence to the current and emerging technologies. We look forward to your participation to make ITherm 2008 lively and intellectually stimulating.
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Dr. Tom Lee
General Chair, ITherm 2008
Assembly and Test Services
TSMC North America
2585 Junction Avenue
San Jose, CA 95134
408-382-8070 (office)
Email: [email protected]
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Prof. Yogendra Joshi
Program Chair, ITherm 2008
G. W. Woodruff School of Mechanical Engineering
Georgia Institute of TEchnology
Atlanta, GA 30332 USA
Phone; 404-385-2810
Email: [email protected] |
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