Mechanics of Interfaces in Microelectronic Packaging
Professor Jianmin Qu, Woodruff School of Mechanical Engineering, Georgia Institute of Technology
Course Description (2 hrs):
Due to the ever increasing needs for large scale integration of heterogeneous systems, the number of interfaces in an electronic package increases dramatically over the last decade, and is predicted to further increase in the future. The meet the size and functionality requirements on electronic devices, smart and multi-functional material interfaces need to be integrated. This requires not only the experimental tools to characterize interfaces, but also predictive modeling techniques to design and engineering interfaces.
In this course, existing modeling/characterization methodologies for interfaces commonly seen in microelectronic packaging will be reviewed. Discussions will also include recent development in multi-scale, multi-physics modeling and characterization tools for engineering smart and multi-functional interfaces for nano and microelectronics.
Hour 1: review of existing continuum modeling/characterization techniques for metal/ceramic, metal/polymer interfaces
Hour 2: review of recent development in multi-scale, multi-physics modeling of interfaces
Bio:
Dr. Jianmin Qu is a Professor and Associate Chair for Administration in the School of Mechanical Engineering at Georgia Tech. He received his M.S. and Ph.D degrees in Theoretical and Applied Mechanics from Northwestern University in 1984 and 1987, respectively. His research interest is in the areas of micromechanics of composites, interfacial fracture and adhesion, fatigue and creep damage in solder alloys, thermomechanical reliability of microelectronic packaging, and ultrasonic nondestructive evaluation of advanced engineering materials. He has authored/co-authored one book, and over 200 papers and book chapters in these areas. He is a fellow of ASME and currently serving as an Associate Editor for the Journal of Electronic Packaging. He has taught short courses in the general area of microelectronic packaging reliability in various professional conferences in Asia, Europe, South America and the US.
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