An Introduction to the Analysis of Delamination in IC Packages Using Fracture Mechanics
Dr Andrew Tay, Professor of Mechanical Engineering, National University of Singapore
|
 |
| Andrew Tay |
|
|
Course Description (2 hrs):
The objective of this short course is to provide an introduction to interfacial fracture mechanics and its application to the analysis of fracture and delamination in IC packages. An introduction to the fundamentals of interfacial fracture mechanics will first be given together with a description of some numerical methods of calculating fracture mechanics parameters such as strain energy release rate and mode mixity. Some popular methods of measuring fracture toughness of interfaces will be presented. Fracture mechanics methodology will then be applied to analyze the popcorn cracking failure of plastic-encapsulated IC packages undergoing solder reflow. The effect of moisture in engendering hygrostress and degrading interfacial fracture toughness will be discussed. Simulation of heat transfer and moisture diffusion processes occurring during package qualification will be described. Experiments which verify the methodology for predicting delamination in packages using the fracture mechanics approach will then be described followed by some interesting case studies.
Bio:
Dr Andrew Tay is a Professor in the Department of Mechanical Engineering, National University of Singapore. He obtained his B.E. (First Class Honors and University Medal) and PhD in Mechanical Engineering from the University of New South Wales, Australia. His research interests include thermomechanical failure of IC packages, thermal management, wafer level packaging, solder joint reliability and MEMS. He is a former Associate Editor of the ASME Journal of Electronic Packaging and a former member of the editorial boards of Microelectronics Journal and Finite Elements in Analysis and Design. He was the General Chairman of the First and the Second IEEE Electronic Packaging Technology Conference (EPTC'97 and EPTC'98), Singapore. He has served and is still serving in the International Advisory Board and Organising committees of several international packaging conferences such as ECTC, InterPack, EPTC, ITHERM, EuroSime, THERMINIC, DTIP, EMAP, EPRL and HDP. For his outstanding achievements and contributions, he was awarded an IEEE Third Millennium Medal in 2000. He also received the 2004 ASME EPPD Engineering Mechanics Award for outstanding contributions in the application of engineering mechanics to electronics and/or photonics packaging. He is a Fellow of the ASME and of the Institution of Engineers Singapore.
|
|