High Resolution Thermal Metrology for Electronic Systems
Kenneth Goodson
Professor of Mechanical Engineering
Stanford University
Goodson@Stanford.Edu
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Course Description (2 hrs):
The past two decades have dramatically improved the spatial and temporal resolution available for the thermal characterization of electronic systems. This progress has been motivated by decreasing dimensions (and thermal resistances) of both on-chip and off-chip structures including thermal interface materials, nanotransistors, interconnects and dielectric films, metal vias, as well as novel cooling structures including thermoelectric and microfluidic heat sinks. This course will summarize advancements in optical and electrical thermometry and thermal property measurement techniques with a focus on those that have established new areas of research and diagnostics of relevance for the semiconductor community. Class participation will assume very basic knowledge of heat transfer and electronic system design.
Bio:
Ken Goodson is a Professor of Mechanical Engineering at Stanford University. His research group includes 15 students and research associates studying thermal transport phenomena relevant for electronic systems, with a focus on those occurring with very small length and time scales. Prof.Goodson has authored or co-authored more than 150 journal and conference papers and five book chapters. He is Editor-in-Chief for Nanoscale and Microscale Thermophysical Engineering. His group has been recognized through the ONR Young Investigator Award, the NSF CAREER Award, the Journal of Heat Transfer Outstanding Reviewer Award, a JSPS Visiting Professorship at the Tokyo Institute of Technology (1996), as well as Best Paper Awards at SEMI-THERM, the Multilevel Interconnect Symposium, and SRC TECHCON. Prof. Goodson is a co-founder and former CTO of Cooligy, which develops microfluidic cooling technology for computers.
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