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Employing Innovative Cooling Technologies in Present and Future Electronic Products
Gamal Refai-Ahmed, Ph.D., Fellow ASME, AMD Fellow, AMD Inc
Professor Dereje Agonafer, Ph. D., Fellow ASME, University of Texas at Arlington
Professor Bahgat Sammakia, Ph.D., Fellow ASME, Binghamton University
Course Description (4 hrs):
This Course will discuss innovative thermal solutions for current and future electronics products. There will be numerous cooling solution examples based on the instructors combined 6 decades of industrial and academic experience. The topics will include:
Part I (2hrs)- Challenges in the Present and future generation of electronic products
* Power Roadmap - NEMI and ITRS
* First Level Package Thermal Challenges
o Thermal Interfaces - review, contribution to the thermal budget, current technologies and implementation
o Non-uniform power - trend review and proposed solutions
o Heat Spreaders - trend review, contribution to the thermal budget, current technologies and implementation
o Heat Pipe Implementation - review (including vapor chamber), current technologies and implementation
o Heat sinks - review, current trends and implementation
* Packaging Trends - System on a Chip (SOC) and Stacked Packages / Dice
* Technology Trends & Challenges and Thermal Impact - lithography, high and low-k dielectrics, multi-core
Part II (2hrs)- Identified solutions for the Present and future generation of electronic products
* Air Cooling -Limits of Air Cooling
* Liquid Cooling - micro-channels and micro-pumps implementations and challenges
* Refrigeration Cooling - current state and future potential
* Thermoelectrics - review, current trends and implementation
* Cooling Technology for 3D Packaging
BIO:
Gamal Refai-Ahmed was born in Alexandria, Egypt where he obtained his B. Sc. and M. Sc. degrees from Alexandria University, Egypt. He obtained an M. A. SC. and Ph. D. in Mechanical Engineering from the University of Waterloo, Canada. He has specialized in the thermal management of electronic and optical packaging where he developed innovative electronic packaging products in Nortel, Astec-Emerson, Cisco, Ceyba and ATI Technologies. Currently, he is the AMD Fellow and Chief Thermal Architect of the Graphics Products Group. He is the author of more than 45 technical papers and 10 pending patents. He advocates the importance of the thermal effect in electronic packaging of the next generation of multi-media systems. He has been involved in the organization of many national and international conferences. In 2004, ASME awarded Dr. Refai a fellow grade as he is recognized as one of the world's experts in thermal management of electronic packaging. In 2006, he elected to be member of the executive committee of electronic and photonic packaging division, EPPD, ASME and In 2007, he elected to be the secretary of the electronic packaging committee, K-16, Heat transfer Davison, ASME. Dr. Refai-Ahmed is member of the organized teams of the premier conferences of electronic packaging, IPACK and ITHERM, for ASME and IEEE since 2000.
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