ITherm 2012

Course Description (2hrs):
This course will provide a broad overview of various measurement methods and techniques that are available and practiced in the field of electronics cooling and thermal management. It will start with an introduction discussing about pros and cons of modeling, simulation and measurement methods, as well as defining the type of errors associated with measurement uncertainties. The main presentation will have a number of sub-sections, each deal with different areas of experimental methods for temperature measurements, thermal imaging, pressure measurements, flow measurements, and flow visualization. The basic theory of temperature measurement methods, fundamental physics behind fluid flow measurements, usage conditions of visualization techniques and operational requirements of various devices and equipment will be discussed.

Bio:

Dr. Lee is Chief Technology Officer of Nextreme Thermal Solutions where he is responsible for setting the corporate directions for technology development and providing high performance thermal management solutions to Nextreme’s customers. Prior to joining Nextreme, he held positions at Intel Corporation as Senior Thermal Scientist, Amkor Technology as Manager of Thermal Characterization, Aavid Thermal Technologies as Director of Advanced Thermal Engineering, and at the University of Waterloo in Ontario as Assistant Professor of Mechanical Engineering. Dr. Lee is an active member of the ASME Heat Transfer Division K-16 Committee on Heat Transfer in Electronic Equipment and the IEEE/SemiTherm Executive Committee. He has organized numerous technical programs and sessions, published over 60 technical papers and 16 patents covering thermal issues in electronics. He lectured many professional courses in various locations and conferences, including the ASME Satellite Course on Commercial Application of Heat Sinks. He served as the General Chair for the 1998 IEEE SemiTherm International Symposium. He is a recipient of the 2004 best Journal of Heat Transfer paper award from the ASME Heat Transfer Division.