Course Description (2 hrs):
The rapid emergence of nanoelectronics, with the consequent rise in transistor density and switching speed, has led to steep increases in die heat flux and growing concern over the emergence of on-chip hot spotsE The application of on-chip high heat flux cooling techniques provides a most promising direction for the thermal management of such nanoelectronic components and is the focus of this tutorial. Attention will be devoted to the use of thin-film and miniaturized thermoelectric coolers, orthotropic heat spreaders, passive immersion cooling, and evaporative cooling in microgap coolers for hot-spot remediation and thermal management of these nanoelectronic chips.
Bio:
Avram Bar Cohen is Distinguished University Professor and Chair of Mechanical Engineering at the University of Maryland, where he continues his research in the thermal management of micro/nano electronic and photonic systems. He is the co-author (with A.D. Kraus) of "Design and Analysis of Heat Sinks" (1995) and "Thermal Analysis and Control of Electronic Equipment" (1983) and has co-edited 13 books in this field. He has authored and co-authored nearly 300 Journal papers, Refereed Proceedings papers, and Chapters in books, and has delivered more than 60 Keynote, Plenary, and Invited Lectures at major technical Conferences and Institutions. He is currently the Editor-in-Chief of Transactions and a member of the Board of Governors of the IEEE CPMT Society.
Bar-Cohen is an Honorary Member of ASME and Fellow of IEEE. He received the 2007 InterPack Achievement Award, the 2001 IEEE CPMT Society Outstanding Sustained Technical Contributions Award, the 2000 ASME Worcester Reed Warner Medal, and was earlier recognized with the ASME Heat Transfer Memorial Award and the ASME Curriculum Innovation Award in 1999 (with S. Bhavnani and Y. Joshi), the ASME/IEEE ITHERM Achievement Award in 1998, ASME Edwin F. Church Medal in 1994, and the THERMI Award from the IEEE/Semi-Therm Conference in 1997.
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