Thermal Engineering of Phase Change Random Access Memory (PCRAM) Devices
Mehdi Asheghi and Ken Goodson
Mechanical Engineering Department, Stanford University, Stanford, CA 94305
Email: masheghi@stanford.edu
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| Mehdi Asheghi |
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| Ken Goodson |
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Course Description (2 hrs):
Despite very encouraging progress in recent years, the phase change random access memory (Ovonic Unified Memory, OUM) technology still faces many challenges including but not limited to its reliability (lifetime), power consumption and speed, the resolution of which is essential before its commercialization. The electrical performance of OUM is strongly coupled to its thermal behavior however very little effort has been directed to fully understand the later. This workshop will provide an overview of relevant thermal phenomena that can impact both performance and the reliability of OUM devices. A review of thermal characterization techniques and tools as well as extensive data on thermal properties of its constituent components, in particular the phase change layer, will be provided.
Bio:
Mehdi Asheghi completed his Ph.D. (1999) and postdoctoral (2000) at the Stanford university conducting research in the area of nanoscale thermal engineering of microelctronic devices. He led a well-known and funded research program (2000-2006) at the Carnegie Mellon University that focused on nanoscale thermal phenomena in semiconductor and data storage devices. He is currently a consulting associate professor at the Stanford University focusing on further development of PCRAM technology. He is the author of more that 100 book chapters, journal publications and fully-reviewed conference papers.
Ken Goodson joined Stanford University in 1994, where he is a Professor with the Mechanical Engineering Department. He received the B.S. (1989), M.S. (1991), and Ph.D. (1993) in Mechanical Engineering from the Massachusetts Institute of Technology, as well as the B.S. (1989) and Louis Sudler Prize in Humanities. The Goodson group studies thermal transport phenomena with very small length and time scales, in particular those relevant for the design of transistors, semiconductor lasers, and MEMS. A number of his students are working on two-phase microchannel and micro-jet impingement cooling technology for semiconductor chips. His group also studies the applications of MEMS technology for biomedical diagnostics, thermal machining, and infrared imaging.
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