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Energy Efficient Thermal Management of Data Centers
Yogendra Joshi
Georgia Institute of Technology
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| Yogendra Joshi |
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In 2006, data centers in the United States consumed about 61 billion kWh, or 1.5 % of total U.S. electricity consumption, for a total electricity cost of about $4.5 billion. This estimated level of electricity consumption is equivalent to the amount of electricity consumed by approximately 5.8 million average U.S. households and is estimated to be more than double the electricity that was consumed for this purpose in 2000. Such sharp rise in energy consumption by data centers has prompted a directive by the United States Congress, and a coordinated response by the various stake-holders.
A significant fraction of the energy costs associated with the operation of a typical data center can be ascribed to the cooling hardware. In this tutorial, I will focus on energy efficient thermal management of data centers. Starting from the trends in energy consumption by cabinets and data centers we will move to a number of metrics to quantify energy efficiency. Recent federal government initiatives on energy efficient data centers will next be discussed. In the second half, we will focus on thermal management techniques to handle the projected sharp increases in server heat loads, as well as on computer-aided design tools to enable robust and sustainable design of data center facilities of the future.
Bio:
Yogendra Joshi is Professor and John M. McKenney and Warren D. Shiver Distinguished Chair at the G.W. Woodruff School of Mechanical Engineering at the Georgia Institute of Technology. He received a Bachelor of Technology degree in Mechanical Engineering from the Indian Institute of Technology in Kanpur in 1979, Master of Science in Mechanical Engineering from the State University of New York, Buffalo in 1981, and a Doctor of Philosophy in Mechanical Engineering and Applied Mechanics, from the University of Pennsylvania in 1984. He is the author or co-author of over 200 archival journal and conference publications, and is an elected Fellow of the ASME and the American Association for the Advancement of Science. He has served as Associate Editor for the ASME J. of Electronics Packaging for two terms and is currently an Associate Editor for the ASME J. Heat Transfer. He was a co-recipient of ASME Curriculum Innovation Award (1999), Inventor Recognition Award from the Semiconductor Research Corporation (2001), and the ASME Electronic and Photonic Packaging Division Outstanding Contribution Award in Thermal Management (2006).
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